Polishing Suspension, Polishing Slurry, Diamond Slurry manufacturer / supplier in China, offering CMP Polishing Slurry Suspension Diamond Alumina Silica, Belt Sander Rubber Contact Wheel 350x50mm, Belt Sander Rubber Contact Wheel 300x50mm and so on.
Min. Order / Reference FOB Price | |
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10 ct | Contact Supplier |
Local Area: | Shanghai, China |
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R&D Capacity: | OEM, ODM, Other |
Payment Terms: | LC, T/T, PayPal |
Material: | Diamond |
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Usage: | Polishing |
Customized: | Customized |
Synthetic Diamond Powder
Product Characteristics:
1.Top-quality single crystal diamond materials,technical date such as static pressure strength,
abrasive performance and thermal stability are higher than standards of the industry;
2.Round and smooth crystal;fewer absorbed particles on powder surface;no bar-or plate-shape particle;
3.Extremely narrow range of granularity distribution and excellent granularity control;
4.Special processing techniques enable tne content of impurities to be about 1/100000.
Recommended Applications:
The products are suitable for application in cosmetic industries and industries that have high demand on grinding and polishing, such as the precision equiepment industry,as well as in sectors that are strict with impurity content,like electroplating and production of polycrystalline diamond compacts.
Polycrystalline Diamond Powder Description
SIGNI detonation polycrystalline diamond (PCD) is similar with natural Carbonado in the structure. Therere thousands of micro crystallites size of 3-10nm integrated together into polycrystalline structure through unsaturated bond. PCD has many more cutting surfaces, resulting in the higher removal rates. It also has good self-sharpening properties. The polycrystalline structure will open every time new sharp edges introduced by releasing an outer layer of dull crystallites. The polycrystalline diamond can lap and polish any materials fast while produce the smoothest surface without scratches.
Specifications:
Type
D10(μm)
D50(μm)
D90(μm)
D95(μm)
PCD0-1
≥0.32
0.45-0.55
≤0.95
≤1.20
PCD0-2
≥0.50
0.90-1.10
≤2.00
≤2.30
PCD1-3
≥1.10
1.80-2.10
≤3.50
≤3.80
PCD2-4
≥1.80
2.70-3.10
≤4.40
≤4.80
PCD3-6
≥2.90
4.00-4.50
≤5.90
≤6.60
PCD4-8
≥3.90
5.20-5.90
≤9.00
≤10.00
PCD5-12
≥4.80
7.50-8.50
≤13.00
≤15.00
Features:
High removal rates and good self-sharpening properties can achieve superior finishes to any hard materials.
High purity, impurity content below 0.5%.
High wearability and long working life.
Applications:
Used as high precise abrasives:
Sapphire process, such as back lapping and polishing of sapphire-based LED epitaxial wafers
Lapping and polishing of magnetic heads, hard disk, CMOS chips, ceramics, glass, hard alloy, optics lens, etc
Used as additives for the electroplating films of metal molds, tools, metal parts to improve their wear resistance, surface hardness and service life